I pass after shipment and give "absolute relief".
I apply stress to a chip card in the long-side direction, the short-side
It is a device detecting poor adhesion of a chip card module equipped with by a contact type chip card. (the detection method is applying for a patent)
By such an inspection, I detect "the module which may come off in the future",
In the shipment of a chip card used in a severe scene, I provide great security.
|Basic function||I bend it (the long-side direction, the short-side direction) and give
a test poor in the + adhesion|
I bend it (the long-side direction, the short-side direction) and inspect + polling
I bend it (the long-side direction, the short-side direction), and +DC gives a characteristic test
Module appearance (wound, uneven coloring) inspection for contact type chip cards
|Reference external form dimensions||The main body: 2,800W X 1800H X 900D (mm)|
|Demand facilities||Three aspect 200V30A|
Air 0.5Mpa 70L/min